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  1. general description the uba2024 is a family of high-voltage monolithic integrated compact fluorescent lamp (cfl) drivers for a large range of lamp powers. specific versions are optimized for 230 v and 110 v mains supplies. the product family integrates full cfl controller functionality with high voltage half-bridge trans istors. all products in the uba2024 family are pin-to-pin compatible enabling a single application design covering a wide range of power ratings. the ic features a soft start function, an adju stable internal oscillator and an internal drive function with a high-voltage level shifter for driving the half-bridge. to guarantee an ac curate 50 % duty cycle, the oscillator signal is passed through a divider before being fed to the output drivers. 2. features and benefits ? the common feature set includes: ? high power efficiency ? a high integration level with low compo nent counts enabling small form factor electronic ballast ? integrated bootstrap diode ? soft start function ? minimum glow time control ? integrated low-voltage supply ? adjustable operating frequency as a result of the embedded oscillator ? an accurate 50 % duty cycle provi ded by an embedded oscillator signal ? integrated half-bridge power transistors ? an internal drive function with a high-voltage level shifter up to 550 v (300 v for the UBA2024BP and uba2024bt) 3. applications ? driver for any kind of half-bridge configured load up to 23 w, provided that the maximum junction temperature is not exceeded ? designed for electronically self-ballasted cfl lamps uba2024 half-bridge power ic for cfl lamps rev. 6.2 ? 1 november 2010 product data sheet
uba2024 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 6.2 ? 1 november 2010 2 of 17 nxp semiconductors uba2024 half-bridge power ic for cfl lamps 4. ordering information [1] for this type number, r ds(on) = 9 and i sat = 900 ma. [2] for this type number, r ds(on) = 6 and i sat = 1350 ma. [3] for this type number, r ds(on) = 6.4 and i sat = 1200 ma. [4] for this type number, r ds(on) = 2 and i sat = 2500 ma. 5. block diagram table 1. ordering information type number package name description version uba2024p [1] dip8 plastic dual in-line package; 8 leads (300 mil) sot97-1 uba2024t [1] so14 plastic small outline package; 14 leads; body width 3.9 mm sot108-1 uba2024ap [2] dip8 plastic dual in-line package; 8 leads (300 mil) sot97-1 uba2024at [3] so14 plastic small outline package; 14 leads; body width 3.9 mm sot108-1 UBA2024BP [4] dip8 plastic dual in-line package; 8 leads (300 mil) sot97-1 uba2024bt [4] so14 plastic small outline package; 14 leads; body width 3.9 mm sot108-1 fig 1. block diagram mdb029 sweep and glow time control high voltage level shifter v dd control high side driver low side driver oscillator divide-by-2 dead time 1,2,3,5,9,10,13 (2) 7 (8) v dd v dd(stop) sw rc sgnd 8 (1) 6 * (7) ** (6) 4 hv fs hs ls out pgnd (3) 11 (5) 14 (4) 12
uba2024 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 6.2 ? 1 november 2010 3 of 17 nxp semiconductors uba2024 half-bridge power ic for cfl lamps 6. pinning information 6.1 pinning 6.2 pin description fig 2. pinning diagram sot97-1 fig 3. pinning diagram sot108-1 uba2024p uba2024ap UBA2024BP sw rc sgnd v dd fs hv pgnd out 014aaa657 1 2 3 4 6 5 8 7 uba2024t uba2024at uba2024bt sgnd out sgnd sgnd sgnd pgnd hv fs sgnd sgnd v dd sgnd rc sw 014aaa804 1 2 3 4 5 6 7 8 10 9 12 11 14 13 table 2. pin description symbol pin sot97-1 pin sot108-1 description sw 1 8 sweep timing input sgnd 2 1, 2, 3, 5, 9, 10, 13 signal ground fs 3 11 high-side floating supply output pgnd 4 12 power ground out 5 14 half-bridge output hv 6 4 high-voltage supply v dd 7 6 internal low-voltage supply output rc 8 7 internal oscillator input
uba2024 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 6.2 ? 1 november 2010 4 of 17 nxp semiconductors uba2024 half-bridge power ic for cfl lamps 7. functional description 7.1 supply voltage the uba2024 does not require an external low-voltage supply as the mains supply voltage applied to pin hv powers it. the ic de rives its own low supply voltage from this for its internal circuitry. 7.2 start-up state with an increase of the supply voltage on pin hv, the ic enters the start-up state. in the start-up state the high-side power transistor is not conducting and the low-side power transistor is switched on. the internal circui t is reset and the capacitors on the bootstrap pin fs and low-voltage supply pin v dd are charged. pins rc and sw are switched to ground. the start-up state is defined until v dd = v dd(startup) . 7.3 sweep mode the ic enters the sweep mode when the voltage on pin v dd > v dd(startup) . the capacitor on pin sw is charged by i sw and the half-bridge circuit starts oscillating. the circuit enters the start-up state again when the voltage on pin v dd < v dd(stop) . the sweep time (t sweep ) is determined by the charge current (i ch(sw) ) and the external capacitor (c sw ). typical the total sweep time set by c sw is: (1) during the sweep time the current flowing through the lamp electrodes performs some preheating of the filaments. see figure 5 . 7.4 reset a dc reset circuit is incorporated in the hi gh-side driver. the high-side transistor is switched off when the voltage on pin fs is below the high-side lockout voltage v float(uvlo) . 7.5 oscillation the oscillation is based upon th e 555-timer function. a self os cillating circuit is made with the external resistor r osc and the capacitor c osc (see figure 4 ). to realize an accurate 50 % duty cycle, an internal divider is used. this reduces the bridge frequency to half th e oscillator frequency. the output voltage of the br idge will change at the falling edge of the signal on pin rc. the design equation for the half-bridge frequency is: (2) an overview of the oscillator signal, internal ls and hs dr ive signals and the output is given in figure 4 . t sweep c sw nf () 10.3 ms = f osc 1 kr osc c osc ----------------------------------------- =
uba2024 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 6.2 ? 1 november 2010 5 of 17 nxp semiconductors uba2024 half-bridge power ic for cfl lamps when entering the sweep mode (v sw = 0 v), the bridge oscillator starts at 2.5 times the nominal bridge frequency and sweeps down to the nominal frequency (bridge), set by r osc and c osc . during the sweep mode th e amplitude of the rc oscillator on pin rc, will swing between v trip(osc)low and v sw +0.4v trip(osc)high . the amplitude of the rc oscillator will continue to increase until v sw +0.4v trip(osc)high =v trip(osc)high , this determines the end of the sweep time. the voltage on pin sw ho wever will continue to rise until it reaches supply voltage level. during this continuous decrease in frequ ency, the circuit appro aches the resonance frequency of the load, and this causes a high voltage across the load, which ignites the lamp. the sweep to resonance ti me should be much larger t han the settling time of the supply voltage on pin hv, to guarantee that the full high-voltage is present at the moment of ignition. see figure 5 . fig 4. oscillator, driver s and output signals time v rc v out 0 hs drive ls drive 0 0 half bridge 0 time time time 014aaa65 8
uba2024 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 6.2 ? 1 november 2010 6 of 17 nxp semiconductors uba2024 half-bridge power ic for cfl lamps 7.6 non-overlap time the non-overlap time is defined as the time when both mosfets are not conducting. the non-overlap time is fixed internally. fig 5. start-up frequency behavior 014aaa65 9 time time time time time t sweep v hv v dd v dd(startup) v sw v dd 0.6v trip(osc)high f osc 2.5 nom v lamp v ign v gloa v nom 0 0 0 0 0 nom
uba2024 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 6.2 ? 1 november 2010 7 of 17 nxp semiconductors uba2024 half-bridge power ic for cfl lamps 8. limiting values [1] the maximum junction temperature must not be exceeded. 9. thermal characteristics [1] in accordance with iec 60747-1 table 3. limiting values in accordance with the absolute ma ximum rating system (iec 60134). symbol parameter conditions min max unit v hv voltage on pin hv normal operation uba2024p - 373 v uba2024ap - 373 v uba2024t - 373 v uba2024at - 373 v UBA2024BP - 187 v uba2024bt - 187 v mains transients during 0.5 s uba2024p - 550 v uba2024ap - 550 v uba2024t - 550 v uba2024at - 550 v UBA2024BP - 300 v uba2024bt - 300 v v fs voltage on pin fs v hv v hv +14 v v dd supply voltage low voltage; dc supply 0 14 v i dd supply current low voltage; peak value is internally limited; t amb =25 c 05ma v pgnd voltage on pin pgnd referenced to sgnd ? 1+1v v rc voltage on pin rc i rc < 1ma 0 v dd v v sw voltage on pin sw i sw < 1ma 0 v dd v sr slew rate pin out; repetitive ? 4+4v/ns t j junction temperature [1] ? 40 +150 c t amb ambient temperature ? 40 +150 c t stg storage temperature ? 55 +150 c table 4. thermal characteristics symbol parameter conditions typ unit r th(j-a) thermal resistance from junction to ambient in free air [1] so14 package 95 k/w dip8 package 95 k/w r th(j-c) thermal resistance from junction to case in free air [1] so14 package 8 k/w dip8 package 16 k/w
uba2024 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 6.2 ? 1 november 2010 8 of 17 nxp semiconductors uba2024 half-bridge power ic for cfl lamps 10. characteristics table 5. characteristics t j = 25 c; all voltages are measured with respect to sgnd; positive currents flow into the ic. symbol parameter conditions min typ max unit high-voltage supply v hv voltage on pin hv mains transients during 0.5 s; i hv < 30 a uba2024p 0 - 550 v uba2024ap 0 - 550 v uba2024t 0 - 550 v uba2024at 0 - 550 v UBA2024BP 0 - 250 v uba2024bt 0 - 250 v v fs voltage on pin fs mains transients during 0.5 s; i hv < 30 a uba2024p 0 - 564 v uba2024ap 0 - 564 v uba2024t 0 - 564 v uba2024at 0 - 564 v UBA2024BP 0 - 264 v uba2024bt 0 - 264 v low-voltage supply v dd supply voltage v hv =100v; r osc = ; v sw =v dd ; v rc =0v 11.4 12.5 13.3 v start-up state i hv current on pin hv v hv =100v; r osc = ; v sw =v dd ; v rc =0v - - 0.39 ma v dd(startup) start-up supply voltage 10 11 12 v v dd(stop) stop supply voltage 8 8.5 9 v v dd(hys) hysteresis of supply voltage 2 2.5 3 v
uba2024 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 6.2 ? 1 november 2010 9 of 17 nxp semiconductors uba2024 half-bridge power ic for cfl lamps output stage r on on-state resistance hs transistor; v hv =310v; i d = 100 ma uba2024p - 9.7 11 uba2024t - 9.7 11 uba2024ap - 6.5 7.4 uba2024at - 7.0 8.0 hs transistor; v hv =160v; i d = 100 ma UBA2024BP - 2.0 2.35 uba2024bt - 2.0 2.35 ls transistor; i d = 100 ma uba2024p - 8.5 9.4 uba2024t - 8.5 9.4 uba2024ap - 5.7 6.3 uba2024at - 6.2 6.9 UBA2024BP - 2.3 2.55 uba2024bt - 2.3 2.55 v f forward voltage hs; i f = 200 ma - - 2.0 v ls; i f = 200 ma - - 2.0 v bootstrap diode; i f = 1 ma 0.7 1.0 1.3 v i dsat drain saturation current hs; v ds =30v; t j 125 c; v hv = 310 v uba2024p 900 - - ma uba2024ap 1350 - - ma uba2024t 900 - - ma uba2024at 1200 - - ma hs; v ds =30v; t j 125 c; v hv = 160 v UBA2024BP 2500 - - ma uba2024bt 2500 - - ma ls; v ds =30v; t j 125 c uba2024p 900 - - ma uba2024ap 1350 - - ma uba2024t 900 - - ma uba2024at 1200 - - ma UBA2024BP 2500 - - ma uba2024bt 2500 - - ma t no non-overlap time 1 1.35 1.7 s v float(uvlo) undervoltage lockout floating voltage 3.6 4.2 4.8 v table 5. characteristics ?continued t j = 25 c; all voltages are measured with respect to sgnd; positive currents flow into the ic. symbol parameter conditions min typ max unit
uba2024 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 6.2 ? 1 november 2010 10 of 17 nxp semiconductors uba2024 half-bridge power ic for cfl lamps 11. electrostatic discharge i fs current on pin fs v hv =310v; v fs =12.2v uba2024p, uba2024t 10 14 18 a uba2024ap, uba2024at 10 14 18 a v hv =160v; v fs =12.2v UBA2024BP, uba2024bt 10 14 18 a internal oscillator f osc oscillator frequency v sw = 0 v - 150 - khz v sw =v dd - - 60 khz operating; nominal; r osc =100k ; c osc = 220 pf; v sw =v dd 40.05 41.32 42.68 khz f osc /f osc relative oscillator frequency variation r osc = 100 k ; c osc = 220 pf; ? 20 c t j +150 c -2-% k h high-level trip point factor 0.382 0.395 0.408 v trip(osc)high high oscillator trip voltage v trip(osc)high =k h v dd 4.58 4.94 5.29 v k l low-level trip point factor 0.030 0.033 0.038 v trip(osc)low low oscillator trip voltage v trip(osc)low =k l v dd 0.367 0.413 0.483 v k osc oscillator constant r osc = 100 k ; c osc = 220 pf 1.065 1.1 1.35 v sweep function i ch(sweep) sweep charge current v sw = 0 v 215 280 345 na t sweep sweep time c sw =33nf; v dd = 12.2 v 0.28 0.35 0.45 s table 5. characteristics ?continued t j = 25 c; all voltages are measured with respect to sgnd; positive currents flow into the ic. symbol parameter conditions min typ max unit table 6. electrostatic discharge (esd) overview model class jedec classification criteria esdh (human body model) 1c pass at esd pulse 1000 v fail at esd pulse 2000 v esdc (charged device model) c2 pass at esd pulse 200 v fail at esd pulse 500 v esdm (machine model) b pass at 200 v esd pulse < 400 v
uba2024 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 6.2 ? 1 november 2010 11 of 17 nxp semiconductors uba2024 half-bridge power ic for cfl lamps 12. application information fig 6. schematic of 230 v standard compact fluorescent lamp app lication using uba2024 001aan022 c buf 4.7 f l filt 1.8 mh r fus 33 d1 d3 d2 d4 c hb2 47 nf 11 w/150 ma max. 550 v 3.1 mh l la c hb1 47 nf r osc 110 k c osc 180 pf c fs 10 nf c dv 100 pf c vdd 10 nf c la uba2024 sw v dd rc sgnd hv fs out pgnd c sw 33 nf ac mains supply (230 v) cfl 1.5 nf fig 7. schematic of 120 v standard compact fluorescent lamp app lication using uba2024b 001aam620 d2 d3 d1 d4 r osc 26.1 k c sw 470 nf r sw 4.7 m c osc 1.2 nf c fs 10 nf c dvdt 820 pf c hb1 150 nf c bus 33 f r fus 4.7 c hb2 150 nf l r 0.66 mh l filt maximum 300 v 1.5 mh c vdd 10 nf c rs 24 w/300 ma 10 nf uba2024b pgnd out fs hv v dd rc sw sgnd ac mains supply (120 v) cfl
uba2024 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 6.2 ? 1 november 2010 12 of 17 nxp semiconductors uba2024 half-bridge power ic for cfl lamps 13. package outline fig 8. package outline sot97-1 (dip8) references outline version european projection issue date iec jedec jeita sot97-1 99-12-27 03-02-13 unit a max. 12 b 1 (1) (1) (1) b 2 cd e e m z h l mm dimensions (inch dimensions are derived from the original mm dimensions) a min. a max. b max. w m e e 1 1.73 1.14 0.53 0.38 0.36 0.23 9.8 9.2 6.48 6.20 3.60 3.05 0.254 2.54 7.62 8.25 7.80 10.0 8.3 1.15 4.2 0.51 3.2 inches 0.068 0.045 0.021 0.015 0.014 0.009 1.07 0.89 0.042 0.035 0.39 0.36 0.26 0.24 0.14 0.12 0.01 0.1 0.3 0.32 0.31 0.39 0.33 0.045 0.17 0.02 0.13 b 2 050g01 mo-001 sc-504-8 m h c (e ) 1 m e a l seating plane a 1 w m b 1 e d a 2 z 8 1 5 4 b e 0 5 10 mm scale note 1. plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. pin 1 index d ip8: plastic dual in-line package; 8 leads (300 mil) sot97 -1
uba2024 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 6.2 ? 1 november 2010 13 of 17 nxp semiconductors uba2024 half-bridge power ic for cfl lamps fig 9. package outline sot108-1 (so14) unit a max. a 1 a 2 a 3 b p cd (1) e (1) (1) eh e ll p qz y w v references outline version european projection issue date iec jedec jeita mm inches 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 8.75 8.55 4.0 3.8 1.27 6.2 5.8 0.7 0.6 0.7 0.3 8 0 o o 0.25 0.1 dimensions (inch dimensions are derived from the original mm dimensions) note 1. plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. 1.0 0.4 sot108-1 x w m a a 1 a 2 b p d h e l p q detail x e z e c l v m a (a ) 3 a 7 8 1 14 y 076e06 ms-012 pin 1 index 0.069 0.010 0.004 0.057 0.049 0.01 0.019 0.014 0.0100 0.0075 0.35 0.34 0.16 0.15 0.05 1.05 0.041 0.244 0.228 0.028 0.024 0.028 0.012 0.01 0.25 0.01 0.004 0.039 0.016 99-12-27 03-02-19 0 2.5 5 mm scale s o14: plastic small outline package; 14 leads; body width 3.9 mm sot108 -1
uba2024 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 6.2 ? 1 november 2010 14 of 17 nxp semiconductors uba2024 half-bridge power ic for cfl lamps 14. revision history table 7. revision history document id release date data sheet status change notice supersedes uba2024 v.6.2 20101101 product data sheet - uba2024 v.5 modifications: ? figure 5 on page 6 has been changed. ? the glow time section has been removed. ? esd values have been removed from table 3 ? limiting values ? on page 7 , added in to ta b l e 6 ? electrostatic discharge (esd) overview ? on page 10 and one error corrected. ? table 3 ? limiting values ? on page 7 : table notes 2 and 3 have been removed. ? table 5 ? characteristics ? on page 8 : ? v dd supply voltage minimum value has been changed. ? v f forward voltage hs maximum value has been changed. ? k l low-level trip point factor maximum value has been changed. ? v trip(osc)low low oscillator trip voltage maximum value has been changed. ? figure 6 on page 11 have been changed. uba2024 v.5 20100916 product data sheet - uba2024 v.4 uba2024 v.4 20090917 product data sheet - uba2024 v.3 uba2024 v.3 081016 product data sheet - uba2024 v.2 uba2024 v.2 040203 product data sheet - uba2024 v.1 uba2024 v.1 030813 product data sheet - -
uba2024 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 6.2 ? 1 november 2010 15 of 17 nxp semiconductors uba2024 half-bridge power ic for cfl lamps 15. legal information 15.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term ?short data sheet? is explained in section ?definitions?. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple device s. the latest product status information is available on the internet at url http://www.nxp.com . 15.2 definitions draft ? the document is a draft versi on only. the content is still under internal review and subject to formal approval, which may result in modifications or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall hav e no liability for the consequences of use of such information. short data sheet ? a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request vi a the local nxp semiconductors sales office. in case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. product specification ? the information and data provided in a product data sheet shall define the specification of the product as agreed between nxp semiconductors and its customer , unless nxp semiconductors and customer have explicitly agreed otherwis e in writing. in no event however, shall an agreement be valid in which the nxp semiconductors product is deemed to offer functions and qualities beyond those described in the product data sheet. 15.3 disclaimers limited warranty and liability ? information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. in no event shall nxp semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interrupt ion, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. notwithstanding any damages that customer might incur for any reason whatsoever, nxp semiconductors? aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the terms and conditions of commercial sale of nxp semiconductors. right to make changes ? nxp semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use ? nxp semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors accepts no liability for inclusion and/or use of nxp semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer?s own risk. applications ? applications that are described herein for any of these products are for illustrative purpos es only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. customers are responsible for the design and operation of their applications and products using nxp semiconductors products, and nxp semiconductors accepts no liability for any assistance with applications or customer product design. it is customer?s sole responsibility to determine whether the nxp semiconductors product is suitable and fit for the customer?s applications and products planned, as well as fo r the planned application and use of customer?s third party customer(s). customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. nxp semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer?s applications or products, or the application or use by customer?s third party customer(s). customer is responsible for doing all necessary testing for the customer?s applic ations and products using nxp semiconductors products in order to av oid a default of the applications and the products or of the application or use by customer?s third party customer(s). nxp does not accept any liability in this respect. limiting values ? stress above one or more limiting values (as defined in the absolute maximum ratings system of iec 60134) will cause permanent damage to the device. limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the recommended operating conditions section (if present) or the characteristics sections of this document is not warranted. constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. terms and conditions of commercial sale ? nxp semiconductors products are sold subject to the gener al terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , unless otherwise agreed in a valid written individual agreement. in case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. nxp semiconductors hereby expressly objects to applying the customer?s general terms and conditions with regard to the purchase of nxp semiconducto rs products by customer. no offer to sell or license ? nothing in this document may be interpreted or construed as an offer to sell products t hat is open for acceptance or the grant, conveyance or implication of any lic ense under any copyrights, patents or other industrial or intellectual property rights. export control ? this document as well as the item(s) described herein may be subject to export control regulations. export might require a prior authorization from national authorities. document status [1] [2] product status [3] definition objective [short] data sheet development this document contains data from the objecti ve specification for product development. preliminary [short] data sheet qualification this document contains data from the preliminary specification. product [short] data sheet production this docu ment contains the product specification.
uba2024 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 6.2 ? 1 november 2010 16 of 17 nxp semiconductors uba2024 half-bridge power ic for cfl lamps non-automotive qualified products ? unless this data sheet expressly states that this specific nxp semicon ductors product is automotive qualified, the product is not suitable for automotive use. it is neither qualified nor tested in accordance with automotive testing or application requirements. nxp semiconductors accepts no liabili ty for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. in the event that customer uses t he product for design-in and use in automotive applications to automotive s pecifications and standards, customer (a) shall use the product without nxp semiconductors? warranty of the product for such automotive applicat ions, use and specifications, and (b) whenever customer uses the product for automotive applications beyond nxp semiconductors? specifications such use shall be solely at customer?s own risk, and (c) customer fully indemnifies nxp semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive app lications beyond nxp semiconductors? standard warranty and nxp semiconduct ors? product specifications. 15.4 trademarks notice: all referenced brands, produc t names, service names and trademarks are the property of their respective owners. 16. contact information for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com
nxp semiconductors uba2024 half-bridge power ic for cfl lamps ? nxp b.v. 2010. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please se nd an email to: salesaddresses@nxp.com date of release: 1 november 2010 document identifier: uba2024 please be aware that important notices concerning this document and the product(s) described herein, have been included in section ?legal information?. 17. contents 1 general description . . . . . . . . . . . . . . . . . . . . . . 1 2 features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 4 ordering information . . . . . . . . . . . . . . . . . . . . . 2 5 block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2 6 pinning information . . . . . . . . . . . . . . . . . . . . . . 3 6.1 pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6.2 pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 7 functional description . . . . . . . . . . . . . . . . . . . 4 7.1 supply voltage . . . . . . . . . . . . . . . . . . . . . . . . . 4 7.2 start-up state . . . . . . . . . . . . . . . . . . . . . . . . . . 4 7.3 sweep mode. . . . . . . . . . . . . . . . . . . . . . . . . . . 4 7.4 reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 7.5 oscillation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 7.6 non-overlap time . . . . . . . . . . . . . . . . . . . . . . . 6 8 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 7 9 thermal characteristics . . . . . . . . . . . . . . . . . . 7 10 characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 8 11 electrostatic discharge . . . . . . . . . . . . . . . . . . 10 12 application information. . . . . . . . . . . . . . . . . . 11 13 package outline . . . . . . . . . . . . . . . . . . . . . . . . 12 14 revision history . . . . . . . . . . . . . . . . . . . . . . . . 14 15 legal information. . . . . . . . . . . . . . . . . . . . . . . 15 15.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . 15 15.2 definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 15.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 15.4 trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 16 16 contact information. . . . . . . . . . . . . . . . . . . . . 16 17 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17


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